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| IA NT Features Industry standard SMT package Output voltage programmable from 0.75 Vdc to 5.5 Vdc via external resistor 6 A output current Up to 92 % efficiency Small size, low profile Cost-efficient PL CO M Low output ripple and noise High reliability Remote on/off Output overcurrent protection (non-latching) Sequencing function *R oH S MXT6A-12SA SMT Non-Isolated Power Module Description Bourns(R) MXT6A-12SA is a non-isolated DC-DC converter offering designers a cost and space-efficient solution with standard features such as sequencing, remote on/off, precisely regulated programmable output voltage and overcurrent protection. Specifications Parameter INPUT Voltage Current Remote ON/OFF: Low or Open = High = OUTPUT Voltage Adjustment Range Current Voltage Setpoint Accuracy Line Regulation Load Regulation Temperature Regulation Ripple (pk-pk) (20 MHz Bandwidth) Ripple (rms) Dynamic Load Response: 50 % to 100 % Load or 100 % to 50 % Load; (i/t = 2.5 A/s; 25 C) 50 % to 100 % Load or 100 % to 50 % Load; (i/t = 2.5 A/s; 25 C) GENERAL MTBF Operating Temperature Storage Temperature Switching Frequency Efficiency (Vin = 12 Vdc, TA= 25 C, Full Load) -40 -55 300 81.0 84.0 86.0 88.0 90.0 92.0 Applications Min. Nom. Max. Units Notes 8.3 12 14 4.5 Vdc Adc Vdc Vdc Vdc Adc % Vo,set % Vo,set % Vo,set % Vo,set 0 to +85 C 1 F ceramic//10 F tantalum capacitors 1 F ceramic//10 F tantalum capacitors 1 F ceramic//10 F tantalum capacitors 2 x 150 F polymer capacitors 10 A max. 1 mA max. Standard On Off -P Option Off On 2.4 0.75 0.0 -2.0 0.3 0.4 0.4 50 15 200 25 50 50 10,000 0.4 Vin 5.5 6.0 2.0 75 30 mVpk-pk mVrms mV s mV s kHrs +85 +125 C C kHz % % % % % % Vo,set = 1.2 Vdc Vo,set = 1.5 Vdc Vo,set = 1.8 Vdc Vo,set = 2.5 Vdc Vo,set = 3.3 Vdc Vo,set = 5.0 Vdc Intermediate Bus architecture Distributed power applications Workstations and servers Telecom equipment Enterprise networks including LANs/WANs Latest generation ICs (DSP, FPGA, ASIC) and microprocessor powered applications *RoHS Directive 2002/95/EC Jan 27 2003 including Annex. Specifications are subject to change without notice. Customers should verify device performance in their specific applications. Output Voltage Programming Via external trim resistor between Trim and GND: Rtrim = Via application of external voltage between Trim and GND: Vtrim = (0.7 - 0.0667 x {Vo - 0.7525}) [ 10.5 - 1.0 k Vo - 0.7525 ] MXT6A-12SA SMT Non-Isolated Power Module Product Dimensions BOTTOM VIEW 27.9 (1.100) 4.06 (0.160) 4.83 (0.190) 4.06 (0.160) 4.57 (0.180) 4.57 (0.180) 4.06 (0.160) Recommended Pad Layout 27.9 (1.100) 17.53 (0.690) 4.06 (0.160) 4.83 (0.190) SEQ 8.89 (0.350) GND TRIM VOUT 8.64 (0.340) 11.43 (0.450) VOUT TRIM GND SEQ 8.64 (0.340) ON/OFF 0.25 (0.010) VIN 8.89 (0.350) VIN 1.57 (0.062) 2.29 (0.090) ON/OFF 1.5 (0.06) 3.8 (0.150) 6.84 (0.270) MAX. 6.56 (0.258) REF. 1.5 (0.06) 1.5 (0.06) RECOMMENDED PAD SIZE: 3.05 2.41 X MIN. (0.120) (0.095) 3.43 2.79 X MAX. (0.135) (0.110) SIDE VIEW DIMENSIONS: MM (INCHES) Pick and Place Location 11.43 (0.450) TOLERANCES: 0.5 (0.02) 0.25 DECIMAL .XX (0.010) DECIMAL .X 6.22 (0.235) L1 (REF.) 12.2 (0.480) 27.9 (1.100) 1.57 (0.062) How to Order M X T 6A - 12 S A (-P) Configuration * M = Surface Mount Device Pinout Detail PIN 1 2 3 4 5 6 FUNCTION ON/OFF VIN SEQ GND TRIM VOUT Internal Identifier Identifies Sequencing Pin Function Output Current (Amps) Input Voltage (V) Outputs * S = Single Output Voltage (V)* * A = Adjustable Optional Positive On/Off Logic *Fixed output voltage parts and optional features available; contact factory. Derating Output Current vs. Local Ambient Temp & Airflow (Vin = 12 Vdc, Vo = 3.3 Vdc) 7 6 Output Current (A) 5 4 3 2 1 0 25 30 35 40 45 50 55 60 65 70 75 80 85 NC (0 LFM) 1.5 m/s (300 LFM) 1.0 m/s (200 LFM) 0.5 m/s (100 LFM) 2.0 m/s (400 LFM) Ambient Temperature (C) Asia-Pacific: Tel: +886-2 2562-4117 * Fax: +886-2 2562-4116 Europe: Tel: +41-41 768 5555 * Fax: +41-41 768 5510 The Americas: Tel: +1-951 781-5500 * Fax: +1-951 781-5700 www.bourns.com REV. B 08/06 Specifications are subject to change without notice. Customers should verify device performance in their specific applications. |
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